Specifications
| Power Dissipation @ Temperature Rise | 2.0W @ 62°C |
|---|---|
| Width | 0.900" (22.86mm) |
| Length | 0.320" (8.13mm) |
| Package Cooled | SMD |
| Thermal Resistance @ Natural | 31.00°C/W |
| Material | Copper |
| Shape | Rectangular, Fins |
| Material Finish | Tin |
| Attachment Method | SMD Pad |
| Thermal Resistance @ Forced Air Flow | 21.00°C/W @ 200 LFM |
| Type | Top Mount |
| Fin Height | 0.400" (10.16mm) |